PROCESSING METHOD FOR WORKPIECE

PROBLEM TO BE SOLVED: To provide a processing method for a workpiece capable of suppressing generation of chipping.SOLUTION: A processing method for a workpiece is provided for removing a predetermined removal region in an outer periphery of a disc-like workpiece with which multiple devices are formed on a surface. The processing method for the workpiece includes: a first positioning step ST1 of positioning a cutting direction of a cutting blade in a tangential direction of an edge of the workpiece; a first cutting step ST2 of removing a first predetermined removal region by rotating the workpiece while making the cutting blade cut into the workpiece; a second positioning step ST3 of positioning the cutting blade at such an angle that the cutting direction of the cutting blade and a tangent of the edge of the workpiece form an angle that exceeds 0°; and a second cutting step ST4 of removing a second predetermined removal region by rotating the workpiece while making the cutting blade cut into the workpiece. The second predetermined removal region includes a region that is closer to a device region than the first predetermined removal region.SELECTED DRAWING: Figure 3 【課題】チッピングの発生を抑制することができる被加工物の加工方法を提供すること。【解決手段】被加工物の加工方法は、表面に複数のデバイスが形成された円盤状の被加工物の外周の除去予定領域を除去する。被加工物の加工方法は、切削ブレードの切削方向を被加工物の周縁部の接線方向に位置づける第一の位置づけ工程ＳＴ１と、被加工物に該切削ブレードを切り込ませつつ被加工物を回転させて第一の除去予定領域を除去する第一の切削工程ＳＴ２と、切削ブレードの切削方向と被加工物の周縁部の接線とが０度を超える角度に切削ブレードを位置づける第二の位置づけ工程ＳＴ３と、被加工物に切削ブレードを切り込ませつつ被加工物を回転させて第二の除去予定領域を除去する第二の切削工程ＳＴ４とを含む。第二の除去予定領域は、第一の除去予定領域よりもよりデバイス領域に近い領域を含む。【選択図】図３