HIGH FREQUENCY MODULE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To reduce occurrence of deterioration in characteristics due to positional deviation between a waveguide and a back short circuit.SOLUTION: A high frequency module 13 includes: a semiconductor chip 1; a package 6 including a first portion 3A of a back short circuit 3 integrated with the semiconductor chip by a first resin 2, and a first re-wiring line 5 electrically connected to the semiconductor chip and including a portion serving as an antenna coupler 4; and a waveguide 7 with which a second portion 3B of the back short circuit 3 is integrated. In the high frequency module, the package and the waveguide are integrated by a second resin 8 such that the portion serving as an antenna coupler is located between the waveguide and the back short circuit.SELECTED DRAWING: Figure 1 【課題】導波管とバックショートの間の位置ずれによる特性の劣化が生じないようにする。【解決手段】高周波モジュール１３を、半導体チップ１と、半導体チップと第１樹脂２で一体化されたバックショート３の第１部分３Ａと、半導体チップに電気的に接続され、アンテナカプラ４となる部分を含む第１再配線線路５とを有するパッケージ部６と、バックショート３の第２部分３Ｂが一体化された導波管７とを備え、導波管とバックショートとの間にアンテナカプラとなる部分が位置するように、パッケージ部と導波管が第２樹脂８で一体化されているものとする。【選択図】図１