SUBSTRATE PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can reduce restrictions which are made in processing a substrate using a plurality of vacuum processing modules while using ancillary equipment in common in the vacuum processing modules.SOLUTION: The substrate processing apparat...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can reduce restrictions which are made in processing a substrate using a plurality of vacuum processing modules while using ancillary equipment in common in the vacuum processing modules.SOLUTION: The substrate processing apparatus comprises: n-pieces of vacuum processing modules 4A and 4B (n is an integer of 4 or more) by which vacuum processing is performed to a substrate; and an ancillary equipment group such as processing gas supply equipment 81, vacuum exhaust equipment 83 and electric power supply equipment 82 constituting ancillary equipment. The n-pieces of vacuum processing modules 4A and 4B are grouped into first and second group aggregates constituted of a plurality of groups whose combination are different from each other, and ancillary equipment to be selected from the ancillary equipment group is used in common for vacuum processing modules 4A and 4B included in each group for each of the group aggregates.SELECTED DRAWING: Figure 6
【課題】複数の真空処理モジュールにて付帯設備を共通化しつつ、各真空処理モジュールを用いて基板を処理するにあたって発生する制約を低減することが可能な基板処理装置を提供する。【解決手段】基板処理装置は、基板に対する真空処理が行われるn台(nは4以上の整数)の真空処理モジュール4A、4Bと、付帯設備を構成する処理ガス供給設備81、真空排気設備83、電力供給設備82などの付帯設備群と、を備え、前記n台の真空処理モジュール4A、4Bについて、互いに組み合わせが異なる複数のグループからなる第1、第2のグループ集合にグループ分けし、これらのグループ集合毎に、各グループ内に含まれる真空処理モジュール4A、4Bに対して、付帯設備群から選択される付帯設備を共通化している。【選択図】図6 |
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