NEGATIVE PHOTOCURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a negative photocurable resin composition excellent in resolution and capable of forming a cured product having high heat resistance and a high elongation percentage, a dry film having a resin layer obtained from the composition, a cured product thereof, and a printe...

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1. Verfasser: SHIMAMIYA AYUMI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a negative photocurable resin composition excellent in resolution and capable of forming a cured product having high heat resistance and a high elongation percentage, a dry film having a resin layer obtained from the composition, a cured product thereof, and a printed wiring board having the cured product.SOLUTION: The negative photocurable resin composition contains an alkali-soluble resin (A), an organosiloxane compound (B) having a six- or more-membered cyclic siloxane skeleton, and a photopolymerization initiator (C). The organosiloxane compound (B) having a six- or more-membered cyclic siloxane skeleton has a skeleton represented by general formula (1) (where n represents an integer of 1 or more).SELECTED DRAWING: None 【課題】解像性に優れ、高耐熱性および高伸び率の硬化物を形成可能なネガ型光硬化性樹脂組成物、該組成物から得られる樹脂層を有するドライフィルム、その硬化物および該硬化物を有するプリント配線板を提供することができる。【解決手段】(A)アルカリ可溶性樹脂、(B)6員環以上の環状シロキサン骨格を有するオルガノシロキサン化合物、および、(C)光重合開始剤を含み、前記(B)6員環以上の環状シロキサン骨格を有するオルガノシロキサン化合物が、下記一般式(1)で表される骨格を有することを特徴とするネガ型光硬化性樹脂組成物等である。(式中、nは1以上の整数を示す)【選択図】なし