SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a technology capable of achieving a semiconductor device that can suppress a rise in cost of manufacture and that has a good heat radiation property of a terminal.SOLUTION: A semiconductor device 100 comprises: a base plate 4; an insulation substrate 2 provided on an upper surface of the base plate 4; a conductive pattern 1 provided on an upper surface of the insulation substrate 2; a semiconductor chip 3 arranged on an upper surface of the conductive pattern 1; a case 5 that surrounds the base plate 4, the insulation substrate 2, the conductive pattern 1 and the semiconductor chip 3; an encapsulation resin 7 that encapsulates the inside of the case 5; and an external connection terminal 6 arranged on the case 5. One end part of the external connection terminal 6 is connected with the conductive pattern 1. On a surrounding wall part 5a of the case 5, a terminal insertion part 5c into which the other end part of the external connection terminal 6 is inserted is provided. In a state where the other end part of the external connection terminal 6 is inserted into the terminal insertion part 5c, the part other than the other end part, of the external connection terminal 6 is encapsulated by the encapsulation resin 7.SELECTED DRAWING: Figure 2 【課題】製造コストの上昇を抑制し、かつ、端子の放熱性が良好な半導体装置を実現可能な技術を提供することを目的とする。【解決手段】半導体装置１００は、ベース板４と、ベース板４の上面に設けられた絶縁基板２と、絶縁基板２の上面に設けられた導電パターン１と、導電パターン１の上面に配置された半導体チップ３と、ベース板４、絶縁基板２、導電パターン１および半導体チップ３を囲繞するケース５と、ケース５の内部を封止する封止樹脂７と、ケース５に配置された外部接続端子６とを備えている。外部接続端子６の一端部は、導電パターン１に接続され、ケース５の周壁部５ａに、外部接続端子６の他端部が挿入される端子挿入部５ｃが設けられ、外部接続端子６の他端部が端子挿入部５ｃに挿入された状態で、外部接続端子６における他端部を除く部分は封止樹脂７により封止された。【選択図】図２