METHOD AND DEVICE FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for executing a soft pre-wetting processing on a substrate such as a wafer with a small amount of pre-wetting liquid.SOLUTION: There is provided a method for executing a pre-wetting processing: sandwiching a substrate W between a first holding member 54 and a second holding member 58 with the surface of the substrate W exposed from an opening part 58a of the second holding member 58; pressing a seal projection 66 of a substrate holder 18 against an outer circumferential part of the substrate W; pressing a seal block 140 against the substrate holder 18; forming a vacuum in an external space S; executing a seal inspection for testing the sealed state formed by the seal projection 66 on the basis of the change of pressure in the external space S; supplying the external space S with a pre-wetting liquid while evacuating the external space S; bringing the pre-wetting liquid into contact with the exposed surface of the substrate W.SELECTED DRAWING: Figure 7 【課題】ウェハなどの基板に、少量のプリウェット液でソフトプリウェット処理を実行することができる方法を提供する。【解決手段】本方法は、第２保持部材５８の開口部５８ａから基板Ｗの表面を露出させた状態で、基板Ｗを第１保持部材５４と第２保持部材５８との間に挟み、基板ホルダ１８のシール突起６６を基板Ｗの外周部に押し付け、基板ホルダ１８にシールブロック１４０を押し付け、外部空間Ｓ内に真空を形成し、シール突起６６によって形成されたシール状態を、外部空間Ｓ内の圧力の変化に基づいて検査するシール検査を実行し、外部空間Ｓを真空引きしながら外部空間Ｓにプリウェット液を供給し、該プリウェット液を基板Ｗの露出した表面に接触させるプリウェット処理を実行する。【選択図】図７