ACOUSTIC WAVE DEVICE

PROBLEM TO BE SOLVED: To reduce bump failures.SOLUTION: An acoustic wave device comprises: a first substrate provided with a terminal on its lower face, and having a substantially rectangular two-dimensional shape; second substrates each provided with an elastic wave element on its lower face, and mounted on the first substrate so that the elastic wave element is opposed to the upper face of the first substrate through a gap; a first dummy bump provided between the upper face of the first substrate and the lower face of each second substrate and between a first side of the first substrate and the corresponding elastic wave element, and not electrically connected to at least one of the elastic wave element and the terminal; a second dummy bump provided between the upper face of the first substrate and the lower face of each second substrate, and between a second side opposed to the first side and the corresponding elastic wave element and not electrically connected to at least one of the elastic wave element and the terminal; and a connection bump provided between the upper face of the first substrate and the lower face of each second substrate and located on a side closer to the second side rather than the first dummy bump and on a side closer to the first side rather than the second dummy bump in plan view, and serving to electrically connect between at least one elastic wave element and at least one terminal.SELECTED DRAWING: Figure 6 【課題】バンプの不良を抑制すること。【解決手段】下面に端子が設けられ、平面形状が略矩形の第１基板と、下面に弾性波素子が設けられ、弾性波素子が第１基板の上面に空隙を挟み対向するように第１基板上に実装された第２基板と、第１基板の上面と第２基板の下面との間に設けられ、第１基板の第１辺と弾性波素子との間に設けられ、弾性波素子と端子との少なくとも一方と電気的に接続しない第１ダミーバンプと、第１基板の上面と第２基板の下面との間に設けられ、第１辺に対向する第２辺と弾性波素子との間に設けられ、弾性波素子と端子との少なくとも一方と電気的に接続しない第２ダミーバンプと、第１基板の上面と第２基板の下面との間に設けられ、平面視において第１ダミーバンプより第２辺側かつ第２ダミーバンプより第１辺側のみに位置し、弾性波素子の少なくとも１つと端子の少なくとも１つとを電気的に接続する接続バンプと、を具備する弾性波デバイス。【選択図】図６