POWER MODULE SUBSTRATE AND PRODUCTION METHOD THEREOF
PROBLEM TO BE SOLVED: To provide a power module substrate that is not subject to design constraints and a production method thereof.SOLUTION: A power module substrate 10 includes a ceramic substrate 16, an upper copper circuit board 12, and a lower copper circuit board 18. The upper copper circuit b...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; jpn |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a power module substrate that is not subject to design constraints and a production method thereof.SOLUTION: A power module substrate 10 includes a ceramic substrate 16, an upper copper circuit board 12, and a lower copper circuit board 18. The upper copper circuit board 12 and the lower copper circuit board 18 are joined to the ceramic board 16 via a brazing material 14. The upper copper circuit board 12 and the lower copper circuit board 18 have tapered portions in their outlines. The tapered portion has such a shape that the width in the horizontal direction is less than half of the height in the vertical direction.SELECTED DRAWING: Figure 2
【課題】設計上の制約を受けにくい構成のパワーモジュール基板、およびこのパワーモジュール基板の生産方法を提供する。【解決手段】パワーモジュール基板１０は、セラミックス基板１６、上側銅回路板１２、および下側銅回路板１８を備える。上側銅回路板１２および下側銅回路板１８は、それぞれセラミックス基板１６にロウ材１４を介して接合される。上側銅回路板１２および下側銅回路板１８は、その輪郭部にテーパ部を有する。テーパ部は、その水平方向の幅が、垂直方向の高さの半分以下になる形状を呈している。【選択図】図２ |
|---|