PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that makes it possible to sufficiently reduce an influence on a change of an exposure wavelength, and to form a resist pattern having excellent sensitivity, resolution and resist shapes.SOLUTION: A photosensitive resin composition c...

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Hauptverfasser:	ITAGAKI SHUICHI, YUI MOTOAKI, NAGOSHI TOSHIMASA, USUBA MANAMI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that makes it possible to sufficiently reduce an influence on a change of an exposure wavelength, and to form a resist pattern having excellent sensitivity, resolution and resist shapes.SOLUTION: A photosensitive resin composition contains (A) component: binder polymers, (B) component: photopolymerizable compounds, and (C) component: photopolymerization initiators. As the (C) component, contained are both of (C-1) component: acridine compounds and (C-2) component: compounds having oxime ester groups.SELECTED DRAWING: None 【課題】露光波長の変化に対する影響を充分に低減し、かつ、感度、解像度及び、レジスト形状に優れるレジストパターンを形成できる感光性樹脂組成物を提供すること。【解決手段】（Ａ）成分：バインダーポリマー、（Ｂ）成分：光重合性化合物、及び（Ｃ）成分：光重合開始剤を含有し、前記（Ｃ）成分として、（Ｃ−１）成分：アクリジン化合物、及び（Ｃ−２）成分：オキシムエステル基を有する化合物の両方を含有する感光性樹脂組成物。【選択図】なし