EPOXY RESIN, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

PROBLEM TO BE SOLVED: To provide: an epoxy resin which has an excellent balance among fluidity during heat curing, a mold shrinkage factor and an elastic modulus; a composition; and a cured product thereof.SOLUTION: There are provided: an epoxy resin represented by the formula (1); a curable resin c...

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Bibliographische Detailangaben
1. Verfasser:	HIROTA YOSUKE
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide: an epoxy resin which has an excellent balance among fluidity during heat curing, a mold shrinkage factor and an elastic modulus; a composition; and a cured product thereof.SOLUTION: There are provided: an epoxy resin represented by the formula (1); a curable resin composition using the epoxy resin; and a cured product thereof. [Reach independently is an alkyl group having 4 to 8 carbon atoms and may be the same or different each repetition; G is a glycidyl group; and n is a repeating number of 0 to 10 on average.]SELECTED DRAWING: Figure 1 【課題】加熱硬化時の流動性と、成形収縮率、弾性率のバランスに優れるエポキシ樹脂、組成物、およびその硬化物の提供。【解決手段】式（１）で表されるエポキシ樹脂、これを用いる硬化性樹脂組成物、及びその硬化物。〔Ｒ１は夫々独立してＣ４〜８のアルキル基、繰り返しごとに同一でも異なっていてもよく；Ｇはグリシジル基；ｎは繰り返し数で、平均値で０〜１０〕【選択図】図１