HEAT RADIATION STRUCTURE

PROBLEM TO BE SOLVED: To provide a heat radiation structure which can improve heat radiation performance and EMC performance.SOLUTION: A heat radiation structure 1 includes: a heat radiation area extension member 11 which is disposed facing a component 3 and extends a heat radiation area of the comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NISHIO HIROKI, HIDAKA NOBORU, TOUTO TOSHIHIRO, SUGITA NARIMOTO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat radiation structure which can improve heat radiation performance and EMC performance.SOLUTION: A heat radiation structure 1 includes: a heat radiation area extension member 11 which is disposed facing a component 3 and extends a heat radiation area of the component 3; a spring member 12 which is disposed on the side of the heat radiation area extension member 11 which is opposite to a surface facing the component 3 and biases the heat radiation area extension member 11 to the component 3; a holder member 13 fixed to a substrate 2 and supporting the spring member 12; and a heat radiation member 14 which is disposed at the outer side of the spring member 12 with respect to the heat radiation area extension member 11 and is thermally connected with the heat radiation area extension member 11.SELECTED DRAWING: Figure 1 【課題】放熱性能及びEMC性能を向上することができる放熱構造体を提供する。【解決手段】放熱構造体1は、部品3に対向配置されて部品3の放熱面積を拡張する放熱面積拡張部材11と、放熱面積拡張部材11の、部品3と対向する面と反対面側に配置され、放熱面積拡張部材11を部品3に向けて付勢するバネ部材12と、基板2に固定されてバネ部材12を支持するホルダ部材13と、放熱面積拡張部材11に対してバネ部材12よりも外方に配置されるとともに放熱面積拡張部材11に熱的に接続する放熱部材14と、を備える。【選択図】図1