PROCESSING UNIT

PROBLEM TO BE SOLVED: To provide a processing unit which restrains deformation on a work-piece by temperature difference.SOLUTION: A processing unit 200 for performing deposition or etching on a part of the work-piece 10 includes: a vacuum vessel 100 having a first mold 110 with a first concave port...

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Bibliographische Detailangaben
Hauptverfasser:	MOGI KAZUNARI, ASHITAKA YU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a processing unit which restrains deformation on a work-piece by temperature difference.SOLUTION: A processing unit 200 for performing deposition or etching on a part of the work-piece 10 includes: a vacuum vessel 100 having a first mold 110 with a first concave portion 114 in which at least a processing object part of the work-piece 10 is arranged and a second mold 120 arranged opposing to the first mold 110; and a planar masking member 20 arranged on the work-piece 10. The masking member 20 includes a processing region in which a plurality of through holes are formed on a part corresponding to the processing object part of the work-piece 10.SELECTED DRAWING: Figure 1 【課題】ワークの温度差によってワークに変形が生じることを抑制可能な処理装置の提供。【解決手段】ワーク１０の一部に成膜又はエッチングを行う処理装置２００は、ワーク１０の少なくとも処理対象部分が配置される第１窪み部１１４を備える第１の型１１０と、第１の型１１０に対向して配置された第２の型１２０と、を有する、真空容器１００と、ワーク１０上に配置された平板状のマスキング部材２０と、を備える。マスキング部材２０は、ワーク１０の処理対象部分に対応する箇所に、複数の貫通孔が形成された処理領域を有する。【選択図】図１