POLISHING PAD AND PRODUCTION METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide a polishing pad having a self-conditioning function where slurry is not necessary in polishing steps such as wrapping, polishing, finishing and the like and another conditioning step is not necessary and to provide a production method of the same.SOLUTION: In a polis...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a polishing pad having a self-conditioning function where slurry is not necessary in polishing steps such as wrapping, polishing, finishing and the like and another conditioning step is not necessary and to provide a production method of the same.SOLUTION: In a polishing pad including a base material layer and a polishing body layer including a first polishing body containing a first fine grain polishing material and a polishing auxiliary material and a second polishing body containing a second fine grain polishing material and a polymer binder and being coated with an aqueous polyurethane, the second fine grain polishing material is discharged from the second polishing body by dissolving at least a part of the second polishing body with the aqueous solution and the conditioning of the polishing pad is achieved.SELECTED DRAWING: Figure 1
【課題】ラッピング、ポリッシング、フィニッシングなどの研磨工程でスラリーが必要でないと共に、別途のコンディショニング工程が必要でないセルフ−コンディショニング機能を備えた研磨パッド及びその製造方法を提供する。【解決手段】基材層;及び第1微粒研磨材及び研磨補助材を含む第1研磨体と、第2微粒研磨材及び高分子バインダーを含み、水性ポリウレタンでコーティングされた第2研磨体とを含む研磨体層;を含み、前記第2微粒研磨材は、水溶液によって少なくとも第2研磨体の一部が溶解されると前記第2研磨体から放出され、研磨パッドのコンディショニングを行うことを特徴とする研磨パッドを構成する。【選択図】図1 |
---|