LIGHT-EMITTING ELEMENTS BONDING SUBSTRATE AND METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENTS BONDING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a light-emitting elements bonding substrate capable of accurately bonding light-emitting elements to a base plate in which optical waveguides are formed.SOLUTION: The light-emitting elements bonding substrate includes: an optical waveguide (108) formed inside a base plate; a hollow part (103) formed in the base plate; a light-emitting element (104) disposed in the hollow part; and a conductive part (107) formed in an upper layer and/or lower layer of the optical waveguide. The optical axis of the light-emitting element coincides with the center line of the optical waveguide, and a junction part of the light-emitting element is joined to the conductive part.SELECTED DRAWING: Figure 1 【課題】光導波路が形成された基板に発光素子を精度よく接合することができる発光素子接合基板を提供することである。【解決手段】発光素子接合基板は、基板の内部に形成された光導波路（１０８）と、前記基板にくり抜かれたくり抜き部（１０３）と、前記くり抜き部に設置された発光素子（１０４）と、前記光導波路の上層かつ／又は下層に形成された導電部（１０７）と、を有し、前記発光素子の光軸は、前記光導波路の中心線に一致し、前記発光素子の接合部は、前記導電部に接合している。【選択図】図１