SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND MEMORY MEDIUM

PROBLEM TO BE SOLVED: To remove unnecessary objects having a small particle size and stuck to a substrate without affecting a surface of the substrate.SOLUTION: A substrate cleaning method according to an embodiment includes a film-forming processing liquid supply step, a strip-processing liquid supply step, and a dissolving-processing liquid supply step. The film-forming processing liquid supply step supplies film-forming processing liquid including a volatile component and for forming a film on a substrate, to a substrate on which a resist has not been formed yet. The strip-processing liquid supply step supplies to a processing-film obtained by solidification or cure of the film-forming processing liquid on the substrate caused by volatilization of the volatile component, strip-processing liquid for stripping the processing film from the substrate without dissolving the processing film. The dissolving-processing liquid supply step, after the strip-processing liquid supply step, supplies the processing film with dissolving-processing liquid for dissolving the processing film.SELECTED DRAWING: Figure 4 【課題】基板の表面に影響を与えることなく、基板に付着した粒子径の小さい不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液をレジストが形成されていない基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から溶解させることなく剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。【選択図】図４