REFLOW DEVICE AND MANUFACTURING METHOD OF BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a simple reflow device by making solder on a board uniform, and to provide a manufacturing method of the board using the same.SOLUTION: A reflow device 1 performs reflow soldering of a board 90 having a first component 91 and a second component 92 having a heat capacity larger than that of the first component 91. The reflow device 1 includes first through sixth heating sections 11-16, a booth 40 and a control section 80. The control section 80 performs a process for raising the low heat capacity temperature T1 and the high heat capacity temperature T2, and then lowering the low heat capacity temperature T1 and raising the high heat capacity temperature T2, more than one time. Consequently, the low heat capacity temperature T1 is maintained constant equal to or above the melting point Tp of solder, and the high heat capacity temperature T2 can rise to the melting point Tp of solder. Difference between the low heat capacity temperature T1 and the high heat capacity temperature T2 is decreased easily, and the temperature on the board 90 is made uniform. Furthermore, configuration of the reflow device 1 is simplified, because control of the reflow device 1 simply set.SELECTED DRAWING: Figure 1 【課題】基板上のはんだを均一化し、簡易なリフロー装置およびそれを用いた基板の製造方法を提供する。【解決手段】リフロー装置１は、第１部品９１および第１部品９１の熱容量よりも熱容量が大きい第２部品９２を有する基板９０をリフローはんだ付けする。リフロー装置１は、第１−第６加熱部１１−１６、ブース４０および制御部８０を備える。制御部８０は、低熱容量温度Ｔ１および高熱容量温度Ｔ２を昇温し、その後、低熱容量温度Ｔ１が低下するように、かつ、高熱容量温度Ｔ２が上昇する過程を、少なくとも２回以上行う。これにより、低熱容量温度Ｔ１がはんだの融点Ｔｐ以上に一定に維持され、高熱容量温度Ｔ２がはんだの融点Ｔｐに上昇できる。低熱容量温度Ｔ１と高熱容量温度Ｔ２との差が小さくなりやすく、基板９０上の温度が均一化される。また、リフロー装置１の制御を設定するのみであり、リフロー装置１が簡易な構成になる。【選択図】図１