MOLDING MATERIAL, CONDUCTIVE MATERIAL, ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND METHOD FOR MANUFACTURING MOLDED PRODUCT

PROBLEM TO BE SOLVED: To provide a molding material, a conductive material, an electromagnetic wave shielding material and a method for a manufacturing a molded product which can easily mold a molded product having electromagnetic wave shielding properties and conductivity in a wide frequency bandwi...

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Bibliographische Detailangaben
Hauptverfasser:	ANDO YOSHITO, EXILA KUBLA, NISHIGUCHI HIDEKAZU
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a molding material, a conductive material, an electromagnetic wave shielding material and a method for a manufacturing a molded product which can easily mold a molded product having electromagnetic wave shielding properties and conductivity in a wide frequency bandwidth.SOLUTION: A molding material contains ground chips which are obtained by grinding metal and are formed into a filamentous shape, and a resin. When the ground chips and the resin are blended, lecithin is added thereto as an additive. The lecithin improves conductivity and the like of the molding material. The molding material is arranged on a magnet sheet, and is formed as an electromagnetic wave shielding material by hot press. The electromagnetic wave shielding material contains ground chips having various shapes and sizes, and accordingly can shield electromagnetic waves in a wide frequency bandwidth.SELECTED DRAWING: Figure 5 【課題】広い帯域で電磁波遮蔽性を有する導電性のある成形品を容易に成形することができる成形材料、導電性材、電磁波遮蔽材及び成形品の製造方法を提供する。【解決手段】成形材料は、金属を研削して得られ糸状に形成された研削屑と、樹脂と、を含有する。研削屑と樹脂とを配合する際には、添加剤としてレシチンが加えられる。レシチンは、成形材料の導電性等を向上させる。この成形材料は、マグネットシート上に配置され、ホットプレスを行うことにより、電磁波遮蔽材として成形される。この電磁波遮蔽材は、様々な形状及びサイズの研削屑を含んでいるので、広い帯域で電磁波を遮蔽することができる。【選択図】図５