ELECTROLESS COPPER PLATING, REMOVAL LIQUID OF CATALYST USED FOR DEPOSITION OF ELECTROLESS COPPER PLATING, AND APPLICATION THEREOF

PROBLEM TO BE SOLVED: To provide electroless copper plating; and to provide a technology capable of removing in one step, a catalyst used for deposition of electroless copper plating.SOLUTION: There are provided: electroless copper plating containing an acid and a thiourea compound; a removal liquid...

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Bibliographische Detailangaben
Hauptverfasser:	TANIMOTO JUICHI, SHINJO SAYAKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide electroless copper plating; and to provide a technology capable of removing in one step, a catalyst used for deposition of electroless copper plating.SOLUTION: There are provided: electroless copper plating containing an acid and a thiourea compound; a removal liquid of a catalyst used for deposition of electroless copper plating; and a removal method of the catalyst used for electroless copper plating and deposition of electroless copper plating in which a substrate provided with electroless copper plating is treated by the removal liquid.SELECTED DRAWING: None 【課題】無電解銅めっきおよび無電解銅めっきの析出に用いられた触媒を１工程で除去できる技術を提供する。【解決手段】酸およびチオ尿素化合物を含有することを特徴とする無電解銅めっきおよび無電解銅めっきの析出に用いられた触媒の除去液および無電解銅めっきを設けた基板を、前記除去液で処理することを特徴とする無電解銅めっきおよび無電解銅めっきの析出に用いられた触媒の除去方法。【選択図】なし