ACOUSTIC WAVE DEVICE AND MULTI-CHAMFERED SUBSTRATE

PROBLEM TO BE SOLVED: To inhibit deterioration of joint strength.SOLUTION: An acoustic wave device includes: a package substrate 10; a device chip 20 having a substrate 22, acoustic wave resonators 24 provided on a major surface of the substrate 22, and pads 26, each of which is provided electrically connected with the acoustic wave resonator 24 on the major surface of the substrate 22 and has a center area 30 having a shape recessed from an outer peripheral area 32 enclosing the center area 30, the device chip 20 being mounted in a flip-chip mounting method while forming gaps 52, in which the acoustic wave resonators 24 are respectively exposed on the package substrate 10; and bumps 50, each of which is exposed in the gap 52, is embedded in the center area 30 of the pad 26, and joins the package substrate 10 to the device chip 20.SELECTED DRAWING: Figure 1 【課題】接合強度の低下を抑制すること。【解決手段】パッケージ基板１０と、基板２２と基板２２の主面上に設けられた弾性波共振器２４と基板２２の主面上に弾性波共振器２４に電気的に接続して設けられ、中央領域３０が中央領域３０を囲む外周領域３２に対して凹んだ形状のパッド２６と、を有し、パッケージ基板１０上に弾性波共振器２４が露出する空隙５２を有してフリップチップ実装されたデバイスチップ２０と、空隙５２に露出し、パッド２６の中央領域３０に埋め込まれてパッケージ基板１０とデバイスチップ２０とを接合するバンプ５０と、を備える弾性波デバイス。【選択図】図１