HEATING-ELEMENT HOUSING MODULE, IMAGING APPARATUS, AND MOVING BODY

PROBLEM TO BE SOLVED: To emit heat from a heating-element housing module more satisfactorily.SOLUTION: A heating-element housing module 1 comprises: a heating element 5; a first surface 9 on which the heating element 5 is mounted; a substrate 6 having a second surface located on the rear side of the first surface 9, and a hole wall 11 defining at least one through-hole 10 passing through the first surface 9 and the second surface; a body 12; a first case 7 made narrower in diameter away from the body 12, in a position opposite to the through-hole 10, located in the through-hole 10, and having a projection 13 different in hardness from the substrate 6; and a second case 8 including a thermally conductive member, disposed in contact with the heating element 5 or the substrate 6, and fixing the substrate 6 together with the first case so as to dispose the projection 13 in pressure contact with the hole wall 11.SELECTED DRAWING: Figure 2 【課題】発熱体収容モジュールから熱をよりよく放出させる。【解決手段】発熱体収容モジュール１は、発熱体５と、発熱体５が実装された第１の面９と、該第１の面９の裏側に位置する第２の面、第１の面９及び第２の面を貫通する少なくとも１つの貫通孔１０を画定する孔壁１１を有する基板６と、本体１２と、貫通孔１０に対向する位置において本体１２から離れるに応じて細径化し且つ貫通孔１０内に位置し、且つ基板６と異なる硬度の突起１３とを有する第１のケース７と、熱伝導性部材を含んでおり、発熱体５又は基板６に接触し且つ突起１３を孔壁１１に圧接させるように第１のケースとともに基板６を固定する第２のケース８と、を備える。【選択図】図２