HEATING APPARATUS

PROBLEM TO BE SOLVED: To provide a heating apparatus 1 capable of providing the difference in heating temperature at the central part and the outer part of a substrate 2 without increasing the number of heat-generation resistors 4.SOLUTION: A heating apparatus includes: a substrate 2 having a mounting surface 2a on which a wafer W is placed; a heat-generating resistor 4 embedded in the substrate 2; a cylindrical support body 3 which has one end surface 3a connected to a back surface 2b opposite to the mounting surface 2a of the substrate 2 and also has an opening end on one end surface 3a; at least two support body-side passages 5, 6 formed in a peripheral wall of the cylindrical support body 3; and a substrate-side passage 7 which is provided only in the region immediately above the cylindrical support body 3 of the substrate 2 and passes through the substrate 2 to communicate at least two support body-side passages 5, 6.SELECTED DRAWING: Figure 1 【課題】発熱抵抗体４の数を増加させることなく、基体２の中央部と外側部とで加熱温度の差を設けることができる加熱装置１を提供する。【解決手段】ウェハＷが載置される載置面２ａを有する基体２と、基体２に埋設される発熱抵抗体４と、基体２の載置面２ａとは反対の裏面２ｂに接続された一方の端面３ａを有し、一方の端面３ａに開口端を有する筒状支持体３と、筒状支持体３の周壁内に形成された少なくとも２つの支持体側流路５，６と、基体２のうち筒状支持体３の直上領域のみに設けられ、基体２内を通過して少なくとも２つの支持体側流路５，６を連通させる基体側流路７と、を備える。【選択図】図１