CIRCUIT SUBSTRATE, CIRCUIT DEVICE, AND INFORMATION RECORDING DEVICE

PROBLEM TO BE SOLVED: To maintain a compactly folded state.SOLUTION: A circuit substrate 70 includes: a lowermost layer substrate 30b including a conductive circuit 18A; an uppermost layer substrate 30a; and an intermediate layer substrate 30c. A folding line 64 is provided on the lowermost layer su...

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Bibliographische Detailangaben
Hauptverfasser: NANJO KAYOKO, TAKAHASHI HIROKO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To maintain a compactly folded state.SOLUTION: A circuit substrate 70 includes: a lowermost layer substrate 30b including a conductive circuit 18A; an uppermost layer substrate 30a; and an intermediate layer substrate 30c. A folding line 64 is provided on the lowermost layer substrate 30b and a first cutout portion 101 and a second cutout portion 102 extending from the folding line 64 are respectively provided on the uppermost layer substrate 30a and the intermediate layer substrate 30c.SELECTED DRAWING: Figure 5 【課題】コンパクトに折畳まれた状態を維持する。【解決手段】回路基板70は導電回路18Aを含む最下層基板30bと、最上層基板30aと、中間層基板30cとを備えている。最下層基板30bに折曲線64が設けられ、最上層基板30aと中間層基板30cに、折曲線64から延長する第1切取部101と第2切取部102が各々設けられている。【選択図】図5