CIRCUIT SUBSTRATE, CIRCUIT DEVICE, AND INFORMATION RECORDING DEVICE
PROBLEM TO BE SOLVED: To maintain a compactly folded state.SOLUTION: A circuit substrate 70 includes: a lowermost layer substrate 30b including a conductive circuit 18A; an uppermost layer substrate 30a; and an intermediate layer substrate 30c. A folding line 64 is provided on the lowermost layer su...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To maintain a compactly folded state.SOLUTION: A circuit substrate 70 includes: a lowermost layer substrate 30b including a conductive circuit 18A; an uppermost layer substrate 30a; and an intermediate layer substrate 30c. A folding line 64 is provided on the lowermost layer substrate 30b and a first cutout portion 101 and a second cutout portion 102 extending from the folding line 64 are respectively provided on the uppermost layer substrate 30a and the intermediate layer substrate 30c.SELECTED DRAWING: Figure 5
【課題】コンパクトに折畳まれた状態を維持する。【解決手段】回路基板70は導電回路18Aを含む最下層基板30bと、最上層基板30aと、中間層基板30cとを備えている。最下層基板30bに折曲線64が設けられ、最上層基板30aと中間層基板30cに、折曲線64から延長する第1切取部101と第2切取部102が各々設けられている。【選択図】図5 |
---|