SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor module which can reduce noise.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 1 having a first electrode 4, a second electrode and a third electrode 7; a frame 2 which is electrically connected with the second electrode and where the semiconductor chip 1 is installed; a first conductor 10 having a chip junction part 11 which is electrically connected to the first electrode 4, a first junction part 12 which is joined to the chip junction part 11 and projects from the chip junction part 11, and a second junction part 13 which is joined to the chip junction part 11 and projects from the chip junction part 11 and which is at least partially separated from the first junction part 12; and a second conductor 20 electrically connected with the third electrode 7.SELECTED DRAWING: Figure 1 【課題】ノイズを低減できる半導体装置および半導体モジュールを提供する。【解決手段】半導体装置１００は、第１の電極４、第２の電極及び第３の電極７を有する半導体チップ１と、前記第２の電極と電気的に接続され、半導体チップ１が設置されるフレーム２と、第１の電極４に電気的に接続されるチップ接合部１１と、チップ接合部１１と接合しており、且つ、チップ接合部１１から突出している第１接合部１２と、チップ接合部１１と接合し、チップ接合部１１から突出し、且つ、少なくとも一部が第１接合部１２と離間している第２接合部１３と、を有する第１導電体１０と、第３の電極７と電気的に接続される第２導電体２０と、を備える。【選択図】図１