PRINTED CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a printed circuit board improved in joining reliability while achieving both a reduction in the size of an electronic component and high performance, and to provide a manufacturing method therefore, and an electronic apparatus having the printed circuit board.SOLUTIO...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MINEGISHI KUNIHIKO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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