PRINTED CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a printed circuit board improved in joining reliability while achieving both a reduction in the size of an electronic component and high performance, and to provide a manufacturing method therefore, and an electronic apparatus having the printed circuit board.SOLUTION: A printed circuit board comprises: an electronic component having a bottom face and side faces, and a plurality of first rands provided on the bottom face; a printed wiring board having a mounting face and a plurality of second rands provided on the mounting face and corresponding to the plurality of first rands, and on which the electronic component is mounted such that the bottom face and the mounting face are opposite; a solder aggregating member provided outside the plurality of second rands on the mounting face; a plurality of first solders joining the plurality of first rands and the plurality of second rands corresponding to them; a second solder formed on the solder aggregating member; and a thermoplastic resin joined to the bottom face of the electronic component outside the plurality of first rands and to the mounting face of the printed wiring board outside the plurality of second rands.SELECTED DRAWING: Figure 1 【課題】電子部品の小型化及び高性能化と両立しつつ、接合信頼性が向上されたプリント回路板、その製造方法及びそのプリント回路板を備えた電子機器を提供する。【解決手段】底面及び側面を有し、前記底面に複数の第１のランドが設けられた電子部品と、搭載面を有し、前記搭載面に前記複数の第１のランドに対応する複数の第２のランドが設けられ、前記底面と前記搭載面とが対向するように前記電子部品が搭載されるプリント配線板と、前記搭載面において、前記複数の第２のランドの外側に設けられたはんだ凝集部材と、前記複数の第１のランドと、対応する前記複数の第２のランドとを接合する複数の第１のはんだと、前記はんだ凝集部材の上に形成された第２のはんだと、前記複数の第１のランドよりも外側の前記電子部品の前記底面と、前記複数の第２のランドよりも外側の前記プリント配線板の前記搭載面とに接着された熱硬化性樹脂とを備える。【選択図】図１