NOZZLE SUBSTRATE, INK JET PRINT HEAD AND METHOD FOR MANUFACTURING NOZZLE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a nozzle substrate in which a size of an ink ejection port becomes a suitable size.SOLUTION: A nozzle substrate 3 includes a silicon substrate 30, a silicon oxide film 31 formed on a second surface 30b of the silicon substrate 30, and a silicon film 32 formed on a su...

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Bibliographische Detailangaben
Hauptverfasser: YAMAMOTO CHISATO, SHIRAGAMI HIROAKI, MATSUO NOBUFUMI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a nozzle substrate in which a size of an ink ejection port becomes a suitable size.SOLUTION: A nozzle substrate 3 includes a silicon substrate 30, a silicon oxide film 31 formed on a second surface 30b of the silicon substrate 30, and a silicon film 32 formed on a surface of the silicon oxide film 31. A nozzle hole 20 comprises a recess 20a which is formed on a first surface 30a of the silicon substrate 30 and penetrates the silicon substrate 30, and an ink ejection passage 20b having a circular cross section which is formed on a bottom surface of the recess 20a and penetrates a bottom wall of the recess 20a. The ink ejection passage 20b has a diameter which is periodically changed in a depth direction, and a diameter of an ink ejection port 20c, which is an opening end on a side opposite to the recess 20a side, is larger than an average value of a minimum value and a maximum value of the diameter of the ink ejection passage 20b.SELECTED DRAWING: Figure 6 【課題】インク吐出口の大きさが適切な大きさとなるノズル基板を提供する。【解決手段】ノズル基板3は、シリコン基板30と、シリコン基板30の第2表面30bに形成された酸化シリコン膜31と、酸化シリコン膜31の表面に形成されたシリコン膜32とを含み、ノズル孔20は、シリコン基板30の第1表面30aに形成されかつシリコン基板30を貫通する凹部20aと、凹部20aの底面に形成され、凹部20aの底壁を貫通する横断面円形状のインク吐出通路20bとからなり、インク吐出通路20bは、その直径が深さ方向に周期的に変化しており、その凹部20a側とは反対側の開口端であるインク吐出口20cの直径は、インク吐出通路20bの直径の極小値と極大値の平均値よりも大きい。【選択図】図6