HEAT CONDUCTIVITY MEASURING METHOD AND APPARATUS THEREFOR

PROBLEM TO BE SOLVED: To provide a heat conductivity measuring method capable of shortening a measurement time and improving measurement accuracy compatibly without enlarging a facility regardless of the kind of a measurement sample, and an apparatus therefor.SOLUTION: A heat conductivity measuring...

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1. Verfasser: HIRANO TAKUO
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat conductivity measuring method capable of shortening a measurement time and improving measurement accuracy compatibly without enlarging a facility regardless of the kind of a measurement sample, and an apparatus therefor.SOLUTION: A heat conductivity measuring apparatus comprises: a ceramic heater 22 for heating a measurement sample S in a transient manner; a processing device 3; and temperature sensors 24a-24d that are disposed at an equal interval (x). The processing device 3 includes: a representative measurement resin setting part 33 for setting, as a representative measurement region R, the temperature sensors 24b and 24c adjacent to a second attenuation property Z1 in which a peak value of a differentiation value exceeds 1 among second attenuation properties Z1-Z3 obtained by differentiating first attenuation properties Y1-Y3 resulting from subtracting temperature changes of adjacent temperature sensors 24a-24d, and correspondent to the second attenuation property Z2 in which the peak value is less than 1; a heat capacity calculation part 35 for calculating heat capacity C by using a temperature gradient coefficient A based on an attenuation time Δt and a temperature reduction value ΔT of the first attenuation property Y1 corresponding to the representative measurement region R; and a heat conductivity calculation part 36 for calculating heat conductivity λ by using the attenuation time Δt and the temperature reduction value ΔT.SELECTED DRAWING: Figure 2 【課題】測定試料の種類に拘らず設備の大型化を招くことなく、測定時間の短縮化と測定の高精度化とを両立することができる熱伝導率測定方法及びその装置を提供する。【解決手段】測定試料Sを過渡的に加熱するセラミックヒータ22と、処理装置3と、均等間隔xに配置された温度センサ24a〜24dを設け、処理装置3が、隣り合う温度センサ24a〜24dの温度変化を差分した第1減衰特性Y1〜Y3を微分した第2減衰特性Z1〜Z3のうち微分値のピーク値が1を超える第2減衰特性Z1に隣接し且つピーク値が1未満の第2減衰特性Z2に対応した温度センサ24b,24cを代表測定領域Rに設定する代表測定領域設定部33と、代表測定領域Rに対応した第1減衰特性Y1の減衰時間Δtと温度低下値ΔTによる温度勾配係数Aを用いて熱容量Cを演算する熱容量演算部35と、減衰時間Δtと温度低下値ΔTを用いて熱伝導率λを演算する熱伝導率演算部36を有する。【選択図】 図2