PLATED STRUCTURE

PROBLEM TO BE SOLVED: To provide a plated structure that has high corrosion resistance despite its simple structure, and can be used for a long time.SOLUTION: A plated structure 1 has a base material 2 composed of Cu (copper) or Al (aluminum), a buffer metal layer 3 that coats the base material 2, a...

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Bibliographische Detailangaben
Hauptverfasser:	TANAKA TAKESHI, MIYAZONO KOICHI, FUJIMOTO JUNICHIRO, SAKAMOTO KEISHI, YORITA TOSHITAKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a plated structure that has high corrosion resistance despite its simple structure, and can be used for a long time.SOLUTION: A plated structure 1 has a base material 2 composed of Cu (copper) or Al (aluminum), a buffer metal layer 3 that coats the base material 2, and a coating layer 4 that coats the buffer metal layer 3 and is composed of Ir (iridium), Ni (nickel), Ru (ruthenium), or Rh (rhodium). The buffer metal layer 3 is preferably composed of Au (gold) or Ag (silver). The base material 2 and the buffer metal layer 3 may have an adhesion layer 6 formed between them.SELECTED DRAWING: Figure 1 【課題】簡単な構成により耐食性が高く、かつ、長期間使用できるメッキ構造体を提供する。【解決手段】メッキ構造体１は、Ｃｕ（銅）又はＡｌ（アルミニウム）からなる基材２と、基材２を被覆する緩衝金属層３と、緩衝金属層３を被覆するＩｒ（イリジウム）、Ｎｉ（ニッケル）、Ｒｕ（ルテニウム）、Ｒｈ（ロジウム）の何れかでなる被覆層４と、を備える。緩衝金属層３は好ましくはＡｕ（金）又はＡｇ（銀）からなる。基材２と緩衝金属層３との間に密着層６が形成されてもよい。【選択図】図１