LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
PROBLEM TO BE SOLVED: To provide a low-cost conductive carrier element which supplies structural support to a light emitting device (LED) die, and electrical and thermal coupling to the LED die.SOLUTION: A lead-frame that includes at least one carrier element is supplied, the carrier element being p...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a low-cost conductive carrier element which supplies structural support to a light emitting device (LED) die, and electrical and thermal coupling to the LED die.SOLUTION: A lead-frame that includes at least one carrier element is supplied, the carrier element being partitioned to form distinguishable conductive regions to which an LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric body may be placed between the conductive regions of the carrier element.SELECTED DRAWING: Figure 2A
【課題】低コストの導体キャリア素子が、発光デバイス（ＬＥＤ）ダイに対して構造的支持を供給し、電気的及び熱的な結合をＬＥＤダイに供給する。【解決手段】少なくとも１つのキャリア素子を含むリードフレームが供給され、当該キャリア素子は、ＬＥＤダイが取り付けられる区別可能な導体領域を形成するために分割される。キャリア素子がフレームによって分離された場合、導体領域は、互いに、電気的に絶縁される。誘電体が、キャリア素子の導体領域間に配置されてもよい。【選択図】図２Ａ |
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