HIGHLY THERMALLY CONDUCTIVE ORGANIC INSULATING FILM AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a highly thermally conductive organic insulating film which has high thermal conductivity and is flexible.SOLUTION: The highly thermally conductive organic insulating film comprises an organic insulating base material and a filler dispersed in the organic insulating...

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Hauptverfasser: KAWASAKI SHINICHIROU, FUJII TATSUYA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a highly thermally conductive organic insulating film which has high thermal conductivity and is flexible.SOLUTION: The highly thermally conductive organic insulating film comprises an organic insulating base material and a filler dispersed in the organic insulating base material. The filler contains boehmite and an organic compound modifying the boehmite. The minor axis diameter of the filler is 50-120 nm, and the major axis diameter of the filler is 200-1,000 nm. The thermal conductivity of the highly thermally conductive organic insulating film in an in-plane direction is 1.0 W/m K or more.SELECTED DRAWING: None 【課題】熱伝導率が高く、可撓性がある高熱伝導性有機絶縁膜を提供する。【解決手段】高熱伝導性有機絶縁膜は、有機絶縁基材と、有機絶縁基材中に分散されたフィラーとを有する。フィラーは、ベーマイトと、ベーマイトに修飾された有機化合物を含有する。フィラーの短軸径は50〜120nmで、フィラーの長軸径は200〜1000nmである。高熱伝導性有機絶縁膜の面内方向の熱伝導率は、1.0W/m・K以上である。【選択図】なし