LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

PROBLEM TO BE SOLVED: To prevent an inner resin layer from processed at the time of processing of a layer on a surface side when a multilayer resin substrate is fully cut processed by a laser processing apparatus.SOLUTION: A laser processing apparatus 1 is an apparatus for cutting a multilayer resin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HASHIMOTO MOMOKA, YAMAMOTO KOJI, IKEDA TSUYOSHI, ARAKAWA MIKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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