SUBSTRATE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a flexible substrate for achieving an electronic apparatus capable of withstanding against bending and or elongation irrespective of installation position.SOLUTION: A substrate 1 having a flexibility includes: a base material 2 of an elastomer such as silicone rubber...

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Bibliographische Detailangaben
Hauptverfasser: SUGATA TAKASHI, BABA SHUNJI
Format: Patent
Sprache:eng ; jpn
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a flexible substrate for achieving an electronic apparatus capable of withstanding against bending and or elongation irrespective of installation position.SOLUTION: A substrate 1 having a flexibility includes: a base material 2 of an elastomer such as silicone rubber; a wiring pattern 3 containing a resin and conductivity particles, which is formed on the base material having a flexibility; a conductivity member 4 of a metal foil, a metal plating or a metal powder, which is formed on the wiring pattern 3; an electronic component 5; and a joining member 6 containing solder for joining the conductivity member 4 and the electronic component 5.SELECTED DRAWING: Figure 1 【課題】設置位置を問わず、曲げや伸縮に耐性のある電子機器が実現できる基板の折り曲げ性を維持する。【解決手段】基板1は、折り曲げ性を有し、シリコーンゴム等のエラストマからなる基材2と、前記基材上に形成された折り曲げ性を有し、樹脂及び導電性粒子を含む配線パターン3と、配線パターン3上に形成されて、金属箔、金属メッキ又は金属粉末からなる導電性部材4と、電子部品5と、導電性部材4と電子部品5とを接合する、ハンダを含む接合部材6と、を備える。【選択図】図1