CONDUCTIVE ADHESIVE, JOINED BODY AND JOINT

PROBLEM TO BE SOLVED: To provide a conductive adhesive that bonds metals together at a temperature lower than a melting point of conductive metal powder and suppresses bleeding, and to provide a joined body and a junction formed of the conductive adhesive.SOLUTION: A conductive adhesive contains 85...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MIZOWAKI TOSHIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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