OPTICAL WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE OPTICAL WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an optical wiring substrate which reduces the possibility that a resin in a via and a base material are removed or the base material is destroyed and the resin in the via is thus displaced from the original position, and a method for manufacturing the optical wiring...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEKI TOSHITAKE, HORIO TOSHIKAZU, TAKAGI MASARU
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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