OPTICAL WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE OPTICAL WIRING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an optical wiring substrate which reduces the possibility that a resin in a via and a base material are removed or the base material is destroyed and the resin in the via is thus displaced from the original position, and a method for manufacturing the optical wiring substrate.SOLUTION: There is provided an optical wiring substrate 1 having a base material 10 of glass, including: a via 10v extending from a front surface 10ts to a back surface 10bs of the base materia 10; a first resin part 20 filling the inside of the via 10v, the first resin part being made of a transparent resin; and a second resin part 30 connected to the first resin part 20 at an opening 10o1 of the via 10v and joined to a site of the front surface 10ts of the base material 10 which surrounds at least the outer periphery of the via 10v, the second resin part being made of a transparent resin, and the difference in the coefficient of thermal expansion between the resin of the second resin part 30 and the resin of the first resin part 20 being smaller than the difference in the coefficient of thermal expansion between the resin of the second resin part and the base material 10.SELECTED DRAWING: Figure 1 【課題】ビア内の樹脂と基材とが剥離し、または基材が破壊されて、ビア内の樹脂が本来の位置からずれる可能性を低減する光配線基板およびその製造方法を提供する。【解決手段】基材１０がガラスで構成された光配線基板１である。基材１０において表面１０ｔｓから裏面１０ｂｓに向かって伸びるビア１０ｖと、透明な樹脂で構成され、ビア１０ｖ内を満たしている第１の樹脂部２０と、透明な樹脂で構成され、ビア１０ｖの開口部１０ｏ１において第１の樹脂部２０と接続されており、基材１０の表面１０ｔｓのうち少なくともビア１０ｖの外周を囲む部位に接合されている第２の樹脂部３０と、を備える。第２の樹脂部３０を構成する樹脂は、基材１０との間の熱膨張率の差よりも第１の樹脂部２０を構成する樹脂との間の熱膨張率の差が小さい樹脂である。【選択図】図１