WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board and a method of manufacturing the same, and a method of manufacturing a semiconductor device, that are capable of discharging heat from a semiconductor element with efficiency.SOLUTION: A wiring board 10 comprises: a core substrate 20 that has a heat r...

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Hauptverfasser:	HOSODA TETSUSHI, FURUKAWA TADASHI, FURUGEN RYO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board and a method of manufacturing the same, and a method of manufacturing a semiconductor device, that are capable of discharging heat from a semiconductor element with efficiency.SOLUTION: A wiring board 10 comprises: a core substrate 20 that has a heat radiation via 26 extending in a thickness direction; and a rewiring layer 30 arranged on the core substrate 20. The rewiring layer 30 has: an element mounting region 37 for mounting a semiconductor element 71; and a heat radiation metal layer 38 formed around the element mounting region 37. The heat radiation metal layer 38 of the rewiring layer 30 is connected with the heat radiation via 26 of the core substrate 20.SELECTED DRAWING: Figure 1 【課題】半導体素子からの熱を効率良く排出することが可能な、配線基板およびその製造方法、ならびに半導体装置の製造方法を提供する。【解決手段】配線基板１０は、厚み方向に延びる放熱用ビア２６を有するコア基板２０と、コア基板２０上に配置された再配線層３０とを備えている。再配線層３０は、半導体素子７１が搭載される素子搭載領域３７と、素子搭載領域３７の周囲に形成された放熱用金属層３８とを有している。再配線層３０の放熱用金属層３８が、コア基板２０の放熱用ビア２６に接続されている。【選択図】図１