EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing that has improved reflow resistance and moldability without reduced flame retardancy, and an electronic component device comprising an element sealed therewith.SOLUTION: An epoxy resin molding material for sealing comprises...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HAMADA MITSUYOSHI, TAKEMIYA KEIZO, BABA TORU, IKEZAWA RYOICHI, FURUSAWA FUMIO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing that has improved reflow resistance and moldability without reduced flame retardancy, and an electronic component device comprising an element sealed therewith.SOLUTION: An epoxy resin molding material for sealing comprises (A) epoxy resin, (B) curing agent, (C) curing accelerator, (D) inorganic filler, (E1) aryl amino group-containing alkoxysilane compound, and (E2) epoxy group-containing alkoxysilane compound.SELECTED DRAWING: None 【課題】難燃性を低下させることなく耐リフロー性及び成形性に優れる封止用エポキシ樹脂成形材料、及びこれにより封止した素子を備えた電子部品装置の提供。【解決手段】封止用エポキシ樹脂成形材料を（Ａ）エポキシ樹脂と、（Ｂ）硬化剤と、（Ｃ）硬化促進剤と、（Ｄ）無機充てん剤と、（Ｅ１）アリールアミノ基含有アルコキシシラン化合物と、（Ｅ２）エポキシ基含有アルコキシシラン化合物とを含有せしめる。【選択図】なし