SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND RECORDING MEDIUM

PROBLEM TO BE SOLVED: To remove an unnecessary object adhering to a substrate, composed of a material causing dissolution or corrosion by reacting on water, without affecting the surface of the substrate.SOLUTION: A substrate cleaning method includes a deposition process liquid supply step, an exfoliation process liquid supply step, and a dissolution process liquid supply step. The deposition process liquid supply step supplies deposition process liquid, containing a volatile constituent and forming a film on a substrate, to the substrate. The exfoliation process liquid supply step supplies exfoliation process liquid, for exfoliating a treatment film from the substrate, to the treatment film formed by solidification or hardening of the deposition process liquid on the substrate due to volatilization of volatile constituent. The dissolution process liquid supply step supplies dissolution process liquid for dissolving the treatment film to the treatment film, after the exfoliation process liquid supply step. The deposition process liquid contains a polar organic matter, the exfoliation process liquid is a nonpolar solvent not containing water, and the dissolution process liquid is a polar solvent not containing water.SELECTED DRAWING: Figure 4 【課題】水に反応して溶解又は腐食を起こす材料から成る基板の表面に影響を与えることなく、基板に付着した不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液を基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。ここで、成膜処理液は極性有機物を含有し、剥離処理液は水分を含まない非極性溶媒であり、溶解処理液は水分を含まない極性溶媒である。【選択図】図４