GLASS CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a glass circuit board which enables the formation of a fine circuit.SOLUTION: A glass circuit board comprises: a through-hole having a hole formed in a glass substrate, running from one face to the other face of the substrate, and a cylindrical hollow metal layer covering at least an inner wall of the hole; and a metal circuit formed on each face of the glass substrate. The metal circuits formed on both faces of the substrate are partially connected with the through-hole, and the metal circuits on the front side and the backside are electrically connected with each other. At least a hollow part of the through-hole and both faces of the glass circuit board are filled or covered with the same first insulating resin. The first insulating resin includes a thermosetting resin and an inorganic filler. The inorganic filler is 0.4 μm or larger in average particle diameter, and 5 μm or smaller in maximum particle diameter. In the first insulating resin, an amount of the filled inorganic filler is 60 wt% or more, and the mean linear thermal expansion coefficient is 25 ppm or less in a range from 25°C to a glass transition temperature.SELECTED DRAWING: Figure 2M 【課題】微細回路形成可能なガラス回路基板を提供する。【解決手段】ガラス回路基盤は、ガラス基板両面を貫通形成する貫通穴と、少なくとも貫通穴内壁を被覆する円筒状中空の金属層よりなるスルーホールと、ガラス基板両面に形成された金属回路とを有し、両面に形成された金属回路の一部はスルーホールと接続され、表裏が電気的に導通され、少なくともスルーホール中空部とガラス回路基板両面とが同一の第一絶縁樹脂で充填被覆され、第一絶縁樹脂は、熱硬化性樹脂、無機フィラーを含み、無機フィラーの平均粒径０．４μｍ以上、最大粒径５μｍ以下、無機フィラー充填量が６０ｗｔ％以上、２５℃からガラス転移温度以下までの平均線熱膨張係数が２５ｐｐｍ以下である。【選択図】図２Ｍ