ENERGIZATION TEST DEVICE AND ENERGIZATION TEST METHOD

PROBLEM TO BE SOLVED: To provide a technique allowing an electric conduction time to be shortened.SOLUTION: An energization test device comprises: a conductive first buffer material (35) that is provided over a plurality of front surface electrodes (19); a conductive second buffer material (34) that comes in contact with back surface electrodes (21 and 22) provided on a lower surface of a semiconductor wafer (31); a first conductive mechanism (33) that is provided at a position sandwiching the first buffer material between the front surface electrodes and itself; and a second conductive mechanism (32) that is provided at a position sandwiching the second buffer material between the back surface electrodes and itself. Each of the back surface electrodes of the semiconductor wafer is connected to a second end part that is an end part opposite to a first end part of a pn junction part (100), and the first and second conductive mechanisms flow current in a forward direction of the pn junction part.SELECTED DRAWING: Figure 4 【課題】本技術は、検査のための通電時間を短くすることができる。【解決手段】通電検査装置は、複数の表面電極（１９）に跨って設けられる、導電性の第１の緩衝材（３５）と、半導体ウエハ（３１）の下面に設けられる裏面電極（２１、２２）に接触する、導電性の第２の緩衝材（３４）と、表面電極との間で第１の緩衝材を挟む位置に設けられる第１の通電機構（３３）と、裏面電極との間で第２の緩衝材を挟む位置に設けられる第２の通電機構（３２）とを備え、半導体ウエハの裏面電極は、ｐｎ接合部（１００）の第１の端部とは反対側の端部である第２の端部に接続され、第１の通電機構、および、第２の通電機構は、ｐｎ接合部の順方向に電流を流す。【選択図】図４