SHAKING-IN JIG AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a shaking-in jig and a method for manufacturing an electronic component in which, even when a shaking-in jig and a transfer jig come in contact, they are prevented from being firmly adhered, and in which a transfer process is prevented from becoming difficult to execute and the shaking-in jig or transfer jig is prevented from being broken when they are separated.SOLUTION: Provided is a shaking-in jig 10 having an opening 20a disposed so as to face a principal surface 10a and provided with a plurality of recesses 20 into which an electronic component element 11 is shaken, comprising: a shaking-in jig body 21; and a coating layer 22 disposed on the surface of the shaking-in jig body and constituting the principal surface 10a of the shaking-in jig 10 and consisting of a material whose adhesiveness is smaller than the shaking-in jig body. The coating layer is constituted from a material that includes a fluorine compound or a silicone compound. The depth dimension D of the recesses 20 of the shaking-in jig 10 is made larger than the lengthwise dimension L of the electronic component element from a first end face 11a to a second end face 11b.SELECTED DRAWING: Figure 3 【課題】振り込み治具と移載治具とが当接した場合にも、両者が強固に密着することを防止し、移載工程を実施することが困難になることや、両者を引き離す際に振り込み治具や移載治具が破損することのない振り込み治具および電子部品の製造方法を提供する。【解決手段】主面１０ａに開口２０ａが臨むように配設された、電子部品素子１１が振り込まれる複数の凹部２０を備える振り込み治具１０において、振り込み治具本体２１と、振り込み治具本体の表面に配設されて振り込み治具１０の主面１０ａを構成する、振り込み治具本体よりも粘着性の小さい材料からなるコーティング層２２とを備えた構成とする。コーティング層を、フッ素化合物もしくはシリコン化合物を含む材料から構成する。振り込み治具１０の凹部２０の深さ方向の寸法Ｄを、電子部品素子の第１の端面１１ａから第２の端面１１ｂに向かう方向である長さ方向の寸法Ｌより大きくする。【選択図】図３