FLEXIBLE PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of reducing vaporization of moisture contained in an adhesive layer or the like and bubbles caused by outgas from the adhesive layer or the like.SOLUTION: The flexible printed wiring board includes: a base film having insulatin...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMAOKA MAKOTO, ADACHI YOSHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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