FLEXIBLE PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of reducing vaporization of moisture contained in an adhesive layer or the like and bubbles caused by outgas from the adhesive layer or the like.SOLUTION: The flexible printed wiring board includes: a base film having insulatin...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMAOKA MAKOTO, ADACHI YOSHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of reducing vaporization of moisture contained in an adhesive layer or the like and bubbles caused by outgas from the adhesive layer or the like.SOLUTION: The flexible printed wiring board includes: a base film having insulating properties; a conductive pattern laminated on the base film; and a coating film coating the conductive pattern. The coating film has a coating layer and an adhesive layer laminated on the conductive pattern side surface of the coating layer. At least one or a plurality of cuts are formed in the coating layer.SELECTED DRAWING: Figure 1 【課題】接着剤層等に含まれる水分の気化や、この接着剤層等からのアウトガスに起因する気泡を減少することができるフレキシブルプリント配線板の提供を目的とする。【解決手段】本発明のフレキシブルプリント配線板は、絶縁性を有するベースフィルムと、このベースフィルムに積層される導電パターンと、この導電パターンを被覆する被覆フィルムとを備えるフレキシブルプリント配線板であって、上記被覆フィルムが、被覆層と、この被覆層の導電パターン側の面に積層される接着剤層とを有し、少なくとも上記被覆層に１又は複数の切込みが形成されている。【選択図】図１