SURFACE PREPARATION AGENT FOR ELECTRONIC MATERIAL AND METHOD FOR MANUFACTURING ELECTRONIC MATERIAL
PROBLEM TO BE SOLVED: To provide a surface preparation agent for an electronic material which can prevent strong adherence of such particles as abrasive grains or polished dusts and of foreign substances generated from a packing container on a long-term basis and which can significantly reduce forei...
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Format: | Patent |
Sprache: | eng ; jpn |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a surface preparation agent for an electronic material which can prevent strong adherence of such particles as abrasive grains or polished dusts and of foreign substances generated from a packing container on a long-term basis and which can significantly reduce foreign substances remaining on a base plate in a later cleaning step.SOLUTION: The surface preparation agent (B) for an electronic material includes at least one type of chemical compound (A) selected from the group of a chemical compound (a1) expressed by the following general formula (1), a chemical compound (a2) expressed by the general formula (2), and a chemical compound (a3) expressed by the following general formula (3), and further includes water as an essential component.SELECTED DRAWING: None
【課題】砥粒や研磨屑などのパーティクルや、梱包容器などから発生する異物の強固な付着を長期的に防ぎ、後の洗浄工程で基板上の異物の残留を著しく減少させることが可能となる電子材料用表面処理剤を提供する。【解決手段】下記一般式(1)で表される化合物(a1)、下記一般式(2)で表される化合物(a2)及び下記一般式(3)で表される化合物(a3)からなる群から選ばれる1種以上の化合物(A)を含有する電子材料用表面処理剤であって、さらに水を必須成分として含有する電子材料用表面処理剤(B)。【選択図】なし |
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