ELECTRONIC DEVICE
PROBLEM TO BE SOLVED: To provide an electronic device capable of easily suppressing warpage.SOLUTION: An electronic device 100 includes: a printed circuit board 10 in which wiring is formed on a resin substrate; a circuit component mounted on the printed circuit board 10 and electrically connected t...
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| Format: | Patent |
| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electronic device capable of easily suppressing warpage.SOLUTION: An electronic device 100 includes: a printed circuit board 10 in which wiring is formed on a resin substrate; a circuit component mounted on the printed circuit board 10 and electrically connected to the wiring; and a sealing resin 20 formed on the printed circuit board 10, sealing the circuit component, and having a rectangular planar shape. In the electronic device 100, the linear expansion coefficient α1 of the printed circuit board 10 along a transverse direction of the sealing resin 20, the linear expansion coefficient α2 of the printed circuit board 10 along a longitudinal direction of the sealing resin 20, and the linear expansion coefficient α3 of the sealing resin 20 satisfy a relationship of α3 |
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