PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board including a laminated substrate including a surface conductive layer of electrolytic plated copper and a solder resist layer (SR layer), capable of bringing the surface conductive layer and the SR layer into close contact with each other to sup...

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Bibliographische Detailangaben
Hauptverfasser:	TAKAGI KATSUYA, NISHIOKA HIROYUKI
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board including a laminated substrate including a surface conductive layer of electrolytic plated copper and a solder resist layer (SR layer), capable of bringing the surface conductive layer and the SR layer into close contact with each other to suppress delamination.SOLUTION: The printed wiring board includes a laminated substrate 2 and an SR layer 30. The laminated substrate 2 contains a surface conductor layer 26 of electrolytic plated copper on the outermost surface. A bonding layer 50 is interposed between the SR layer 30 and the surface conductor layer 26. The bonding layer 50 is a layer containing copper and nitrogen and having a thickness of 20 to 200 nm.SELECTED DRAWING: Figure 1 【課題】電解めっき銅の表面導体層を含む積層基板とソルダーレジスト層（ＳＲ層）とを備えるプリント配線基板において、表面導体層とＳＲ層とを密着させて層間剥離を抑制する。【解決手段】積層基材２とＳＲ層３０とを有し、積層基材２は電解めっき銅の表面導体層２６を最外面に含み、ＳＲ層３０と表面導体層２６との間には接合層５０が介在しており、接合層５０は、銅と窒素とを含む厚さ２０〜２００ｎｍの層である。【選択図】図１