SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving strength against tensile of a connector terminal.SOLUTION: A semiconductor device 1 includes: a substrate in which an electronic circuit 3 is formed as shown in Fig. 1(a) to Fig. 2(b); a pad part 26 which is provided in the substrate as an input/output terminal of the electronic circuit 3 and has a first through hole 250 penetrating to the back face of the substrate; a lead frame 7 as a connector terminal, whose one end is joined to the pad part 26 and which has a second through-hole 72 forming one through-hole 6 together with the first through hole 250 by joining; and a sealing body 9 which is formed from a sealing resin covering the end of one of the substrate and the lead frame 7 and unifying them and in which the sealing resin is filled into one through hole 6.SELECTED DRAWING: Figure 3 【課題】コネクタ端子の引っ張りに対する強度を向上させることができる半導体装置を提供する。【解決手段】半導体装置１は、図１（ａ）〜図２（ｂ）に示すように、電子回路３が形成された基体と、電子回路３の入出力の端子として基体に設けられ、基体の裏面まで貫通する第１の貫通孔２５０を有するパッド部２６と、一方の端部がパッド部２６と接合され、接合によって第１の貫通孔２５０と共に１つの貫通孔６となる第２の貫通孔７２を有するコネクタ端子としのリードフレーム７と、基体及びリードフレーム７の一方の端部を覆って一体とする封止樹脂から形成され、１つの貫通孔６内に封止樹脂が充填された封止体９と、を備えて概略構成されている。【選択図】図３