METAL ION FEEDING DEVICE
PROBLEM TO BE SOLVED: To provide a metal ion feeding device in which the device configuration is not complex, the degradation of a dissolution rate of metal particles is suppressed, and generation of sludge is prevented.SOLUTION: A metal ion feeding device 100 dissolves metal particles P by distribu...
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| Sprache: | eng ; jpn |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a metal ion feeding device in which the device configuration is not complex, the degradation of a dissolution rate of metal particles is suppressed, and generation of sludge is prevented.SOLUTION: A metal ion feeding device 100 dissolves metal particles P by distributing plating solution in a metal particle cluster and feeds the metal ions thus produced to the plating solution. The metal ion feeding device comprises: a dissolver tank 10 encasing the metal particle cluster and having a porous plate 11 supporting the metal particle cluster inside; and a plating solution feeding pipe 21 that is provided above the dissolver tank 10 and feeds the plating solution from above the dissolver tank 10 to inside of it.SELECTED DRAWING: Figure 1
【課題】装置構成が複雑でなく、金属粒の溶解速度の低下が抑制されてスラッジの生じ難い金属イオン供給装置を提供すること。【解決手段】金属粒群内にめっき液を流通させて金属粒Ｐを溶解させ、生成された金属イオンをめっき液に供給する金属イオン供給装置１００であって、金属粒群を収容し、その内部に金属粒群を支持する多孔板１１を有している溶解槽１０と、溶解槽１０の上部にあってめっき液を溶解槽１０の上部からその内部に提供するめっき液提供管２１と、を備えている。【選択図】図１ |
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