SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure in which semiconductor elements are stacked and capable of reducing the size in the stacking direction.SOLUTION: The semiconductor device includes: a plurality of flat elements 8 stacked in a stacking direction; a disc spring 4 for applying pressure in the stacking direction; a disc spring guide part 5 which presses the flat elements 8 in the stacking direction with a pressing surface of a spherical shape by pressure of the disc spring 4; and a metallic spherical receiving seat 6 that is in contact with the pressing surface of the disk spring guide part 5 at a contact surface of a concave shape and receives a pressing force by the disc spring guide part 5 to transmit a force so as to bring the plurality of flat elements 8 into close contact with each other.SELECTED DRAWING: Figure 1 【課題】 半導体素子が積層される構成を備え、積層される方向のサイズを小さくすることのできる半導体装置を提供することにある。【解決手段】 積層方向に積層された複数の平型素子８と、積層方向に加圧する皿バネ４と、絶縁物で形成され、皿バネ４の加圧により、積層方向に平型素子８を球面形状の押圧面で押圧する皿バネガイド部５と、皿バネガイド部５の押圧面と凹面形状の接触面で接触し、皿バネガイド部５による押圧力を受け、複数の平型素子８を密着させるように力を伝達する金属製球面受け座６とを備える。【選択図】図１