SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing chip cost by reducing a chip area.SOLUTION: An outer shape of a semiconductor substrate 1 is pentagonal. A pre-stage amplifier 4 is formed at one apex 2a side of the pentagon of the semiconductor substrate 1. Post-stage ampl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAMOTO YOSHITSUGU, KAMO NOBUTAKA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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